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    Visiting Research Scientist
  Dr. Shooter is a Professor of Mechanical Engineering at Bucknell University where he has taught since 1995. He is spending sabbatical for 2008/09 at IHMC. His research interests involve information management for design and the design of mechatronic systems and products. Integral to this research is the exploration of approaches for the capture, storage and retrieval of product development information. He is a registered Professional Engineer in the state of Pennsylvania and has been the PI on numerous projects with industry involving new product development and the design of production infrastructure. During the summer of 1997 and the year of 1998/99 he was a research faculty fellow at the National Institute of Standards and Technology (NIST) in the Design Engineering Technologies Group where he developed knowledge-based protocols for a multi-university-based project called the Open Assembly Design Environment. Prior to graduate study he was a Process Engineer for Sony Corporation where he contributed to the start-up of their first compact disc manufacturing plant. He has consulted extensively with the Pennsylvania Small Business Development Center (SBDC) to assist entrepreneurs with new product development enterprises. He developed and implemented an award-winning product development process adopted by all 17 of the state SBDCs. During the academic year 2002/03 he was a Visiting Professor at the Swiss Federal Institute of Technology in Lausanne (EPFL). He has been a PI on a multi-university NSF ITR project to explore information management approaches for product platforms and mass customization. He is currently PI on a multi-university NSF Cyberinfrastructure Teams project to develop CI tools and techniques to support engineering education through product dissection and reverse engineering. He is also Co-PI on an Office of Naval Research project to explore novel designs for mobile robots in urban environments. He is also examining representations for commonality and differentiation of product packaging with application to pharmaceutical labeling safety. More information can be found at